Epoxy-based chip underfill encapsulants are the next evolution in flip chip technology. With their excellent flowability, acceptable CTE, and other desirable properties, they are an ideal choice for stacked semiconductor chips. These encapsulants are manufactured by DeepMaterial. You can learn more about them by reading this article. It may even inspire you to try one yourself. This article will explain how they work, and provide tips for using them in your flip chip applications.
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Epoxy based underfill encapsulants are a turning point for flip chip technology
Underfill encapsulants, consisting of low-viscosity organics that cure into solid forms, are an important step in the flip chip technology process. Underfill is required to improve reliability by distributing the thermomechanical stresses of the flip chip assembly over a larger surface area. Several factors must be considered before a reworkable underfill encapsulant can be used.
They ensure flowability, an acceptable CTE, and other desirable properties
The key to creating an effective underfill for flip chips is to carefully formulate the filler material, ensuring it possesses certain properties. The composition of the underfill material will determine the CTE and flowability of the chip. The amount of the filler material to be used also will depend on the CTE desired. Below are some common underfill materials and their properties.
They are available from DeepMaterial
The capillary-flow subfills by DeepMaterial are excellently suited for CSP devices and BGA or Flip chips. They are made from pot substances and offer excellent fluidity and cure rates. This means they are excellent for very small pitch and are reworkable. As a result, they offer excellent mechanical properties and are suitable for sensitive applications, such as RF devices. For more information, please contact https://www.deepmaterialcn.com/ DeepMaterial today.
They are suitable for stacked semiconductor chips
The application of High Thermal Conductivity (HTC) Based Chip Underfill in the interconnection of stacked semiconductor chips has been studied in various studies. Its high thermal conductivity is expected to significantly reduce thermal resistance by filling the interchip spaces, occupying a larger area than solder bumps. A simulation shows that this material reduces thermal resistance, as compared to a traditional filler material.
They can be injected from injector heads
The use of Based Chip Underfill has many benefits for the semiconductor industry. It enhances the reliability of the Process-On-Chip (PoC) process. Unlike conventional solder, which has inherent settling and warpage properties, Underfill can be injected directly from injector heads. It also protects lead-free solders by ensuring that the process remains clean. In addition to its advantages, Based Chip Underfill is also available in many different types of waterproof adhesives China.
They can be dispensed by capillary flow
Typical capillary underfill is supplied in pre-mixed frozen syringes and is dispensed through dispensing equipment. The traditional method of dispensing capillary underfills involved a needle or a time-pressure dispenser. Increasingly, capillary underfill processes use a jet dispensing system. However, manual application is also possible.
They can be used for micro-BGAs
As solder joints become increasingly smaller, the need for BGA underfill becomes increasingly apparent. These underfills provide excellent mechanical bonding properties, protecting the solder joints from physical stress. Additionally, BGA underfills aid in heat transfer and serve as the primary heat sink for the component. Plasma Ruggedized Solutions employs a specialized BGA underfill process that uses made-to-order materials in frozen states. These materials minimize the possibility of contaminants and are ideal for the precise application requirements.
